Gigabyte Z390 Aorus Master Intel Z390 LGA 1151 with 12 Phases IR Digital VRM, RGB Fusion Gaming Motherboard | Z390 Aorus Master

SKU:Z390 Aorus Master

18 in stock

د.إ 1,364.00 including VAT

  • Supports 9th and 8th Gen Intel® Core™ Processors
  • Dual Channel Non-ECC Unbuffered DDR4, 4 DIMMs
  • Intel® Optane™ Memory Ready
  • 12 Phases IR Digital VRM Solution with PowIRstage
  • Onboard Intel® CNVi 802.11ac 2×2 Wave 2 Wi-Fi
  • USB TurboCharger for Mobile Device Fast Charge Support
  • Intel® Gigabit LAN with cFosSpeed
  • RGB FUSION with Multi-Zone Addressable LED Light Show
  • Front USB 3.1 Gen 2 Type-C™ Header
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In the dark, starless night, the falcon strikes fear into the heart of its prey. Even with minimal visibility, the falcon pinpoints its prey and patiently anticipates the perfect moment to swoop in for the kill. The falcon with its laser sharp gaze dominates the darkness of night in the same manner that AORUS Core Lighting illuminates the vast AORUS ecosystem. Z390 AORUS MASTER motherboard uses an all IR digital CPU power design which includes both digital PWM Controller and PowlRstage MOSFET, and is capable of providing at least 40A of power from each phase, for a total of 480A. These 100% digital controller and additional 8+8 Solid-pin CPU Power Connectors offer incredible precision in delivering power to the motherboard’s most power-hungry and energy-sensitive components, allowing enthusiasts to get the absolute maximum performance from the new 8-core 9th Gen Intel® Core™ processors.

Advanced Thermal Design

Z390 AORUS MASTER reaches a perfect balance between style and performance by combining the media acclaimed Fins-Array heatsink, a heatpipe, and a thermal baseplate, to provide 30% lower MOSFET temperatures for enthusiasts, overclockers and professional gamers.
Fins-Array Heatsink with Direct Touch Heatpipe and High Thermal Conductivity Pad

  • Z390 AORUS MASTER uses Fins-Array Heatsink which increases the heat dissipation area by 300% compared to traditional heatsinks of the same size. Direct Touch Heatpipe helps transfer heat from MOS to heatsink and fins.
  • By using LAIRD 1.5mm thick, 5W/mK high thermal conductivity pads, it can transfer 2.7x more heat compared to traditional thermal pads in the same time period.

Features

  • Supports 9th and 8th Gen Intel® Core™ Processors
  • Dual Channel Non-ECC Unbuffered DDR4, 4 DIMMs
  • Intel® Optane™ Memory Ready
  • 12 Phases IR Digital VRM Solution with PowIRstage
  • Advanced Thermal Design with Fins-Array Heatsink and Direct Touch Heatpipe
  • Onboard Intel® CNVi 802.11ac 2×2 Wave 2 Wi-Fi
  • 125dB SNR AMP-UP Audio with ALC1220 & High-End ESS SABRE 9118 DAC with WIMA audio capacitors
  • USB TurboCharger for Mobile Device Fast Charge Support
  • Intel® Gigabit LAN with cFosSpeed
  • RGB FUSION with Multi-Zone Addressable LED Light Show Design, Supports Addressable LED & RGB LED Strips
  • Smart Fan 5 features Multiple Temperature Sensors and Hybrid Fan Headers with FAN STOP
  • Front USB 3.1 Gen 2 Type-C™ Header
  • Triple Ultra-Fast NVMe PCIe Gen3 x4 M.2 with Triple Thermal Guard
  • USB DAC-UP 2 with Adjustable Voltage
  • CEC 2019 Ready, Save Power With a Simple Click

Brand

GIGABYTE

Weight 1.5000 kg

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