GEFORCE GTX 1660 OC 6144MB GDDR5 PCI-EXPRESS GRAPHICS CARD
The Gigabyte GeForce GTX 1660 OC series delivers the ultimate PC gaming experience. Powered by the new NVIDIA Turing GPU architecture and the innovative GTX platform, featuring 6GB GDDR6 192-bit memory interface that has a 1830 MHz Core Clock, this is a completely new way to experience games. Built with Gigabyte’s Windforce cooling see improved performance in your GPU as the fans alternate their spinning motion allowing hot air to be pushed out quickly whilst reducing turbulence. With a unique blade fan and 3D Active Fan System driving cooling performance you can expect low temperatures even at high loads, and to help the direct touch technology is were the shape of the copper pipes maximizes the direct contact with the GPU resulting in faster heat transfer.
WINDFORCE 2X COOLING SYSTEM
WINDFORCE 2X cooling system features 2x 90mm unique blade fans, alternate spinning fan, a composite copper heat pipe direct touch GPU and 3D active fan functionality, together delivering an effective heat dissipation capacity for higher performance at lower temperatures.
The GIGABYTE patent “Alternate Spinning” is the only solution that can solve the turbulent airflow of adjacent fans. Since the adjacent fans rotate in the same direction, the airflow direction is opposite between the fans, which will cause turbulent airflow and reduce heat dissipation efficiency. GIGABYTE turns the adjacent fans in the opposite direction, so that the airflow direction between the two fans is the same, reducing the turbulence and enhancing the airflow pressure.
UNIQUE BLADE FAN
The airflow is spilt by the triangular fan edge, and guided smoothly through the 3D stripe curve on the fan surface, effectively enhancing the airflow.
HEAT PIPE DIRECT TOUCH GPU
The shape of the pure copper heat pipe maximizes the direct contact area with the GPU, enhancing heat transfer. The heat pipe also covers the VRAM through a large metal plate contact to ensure proper cooling.
The composite heat-pipe combines thermal conductivity and phase transition to efficiently manage the heat transfer between two solid interfaces which increases cooling capacity.